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[°øÇÐ,±â¼ú] ¹ÝµµÃ¼°øÇÐ ½ÇÇè - Metal Deposition / ½ÇÇè 4 : Metal Deposition 1. ½ÇÇè ¸ñÀû MOS CAPÀ» Á¦ÀÛÇÏ´Â ÀüüÀÇ °øÁ¤¿¡¼ ¡®Dry etchingÀ» ½Ç½ÃÇÑ ÈÄ Si±âÆÇ À§¿¡ ±Ý¼ÓÀ» ÁõÂø½ÃÅ°´Â °øÁ¤ÀÎ ¡®Metal depositionÀ» ½Ç½ÃÇÏ¿© ±âÆÇÀÇ ¸éÀúÇ×À» ÃøÁ¤ÇÑ´Ù. ÁõÂø½ÃÅ°´Â ±Ý¼ÓÀ» Ni·Î ÁõÂø µÎ²²¸¦ 10nm, 20nm, 30nm·Î º¯È¸¦ ÁÖ¾î ÁõÂø µÎ²²¸¦ Á¶Á¤ÇÔ¿¡ µû¶ó Á¦Ç°ÀÇ ¸éÀúÇ׿¡ ¾î¶² ¿µ¡¦
Sputter Deposition¿¡ ´ëÇÑ ±ÛÀÔ´Ï´Ù. sputter / 1.3. Interactions on the target surface °¡¼ÓµÈ ¾çÀÌ¿ÂÀÌ °íüǥ¸é¿¡ Ãæµ¹Çϸé Áß¼º¿øÀÚ ¹èÃâ, ÈĹæ»ê¶õ, X¼± ¹æÃâ, ±¤ÀÚ ¹ß»ý, ÀÌÂ÷ ÀüÀÚ ¹æÃâ, ±×¸®°í target Ç¥¸é¿¡¼ ±âü¿øÀÚÀÇ Å»Âø µîÀÌ ¹ß»ýÇϸç, target¿¡¼´Â ºñÁ¤ÁúÈ, ÀÌ¿ÂħÅõ, ÈÇÕ¹° Çü¼º, cascade ¹ß»ý, ±¹ºÎÀû °¡¿, Á¡°áÇÔÀÌ »ý¼ºµÈ´Ù. ÇöóÁ¸¦ À¯ÁöÇϴµ¥ °¡Àå Áß¡¦
[ÀÚ¿¬°úÇÐ] ½ÇÇè - Vacuum depositionÀÇ ÀÌÇØ¿Í ÁõÂø¼Óµµ¿¡ µû¸¥ ¾Ð·Â º¯ÈÃøÁ¤[¿¹ºñ] / ½ÇÇè - Vacuum depositionÀÇ ÀÌÇØ¿Í ÁõÂø¼Óµµ¿¡ µû¸¥ ¾Ð·Â º¯ÈÃøÁ¤[¿¹ºñ] 1. ½ÇÇè ¸ñÀû Áø°ø »ó¿¡¼ÀÇ ¹°ÁúÀÇ ÁõÂøÀ» ÀÌÇØÇÏ°í, ¾Ð·Â¿¡ µû¶ó º¯ÈÇϴ è¹ö ¾ÈÀÇ Áõ¹ß ºÐÀÚ·®À» °è»êÇÑ´Ù. 2. ½ÇÇè °úÁ¤ ½Ã·á ¹× ÀåÄ¡ Áغñ °úÁ¤(¸ðµç ¼¼Ã´°úÁ¤¿¡¼´Â ¹Ýµå½Ã ÀÏȸ¿ë ºñ´Ò Àå°©À» ³¤´Ù.) 1) ±âÆÇ ¡¦
¡¥ Physical Vapor Deposition Áø°ø Áß¿¡¼ ±Ý¼ÓÀ» ±âȽÃÄÑ ±âÆÇ¿¡ ÁõÂø. vaporation E 1. ÁõÂø ÇÏ·Á´Â source materialÀ» µµ°¡´Ï¿¡ ³Ö°í °¡¿. 2. Source materialÀÌ ±âü»óÅ°¡ µÇ¾î ±âÆÇÀÇ Ç¥¸é¿¡¡¦
¡¥g Glass Cleaning Thin Film Deposition Color Filter Patterning Device Patterning ITO Deposition ÇÕÆÇ°øÁ¤ Orientation Film Application & Rubbing Assembly Liquid Crystal Injection TF
[¿µ¹®ÀÚ±â¼Ò°³¼] ¹ý·ü ¹ý¹« ƯÇã 960 / 1216room 729-24 Bongcheon-dong Gwanak-gu S.KOREA TEL : +82-2-835-4993 Christine LITIGATION ¹®¼¼½ÄÆ÷Å»ºñÁîÆû Successfully conducted depositions and trials in a variety of media and commercial cases. Achieved favorable resolution of complex, difficult-to-win cases through meticulous work and deployment of group-su¡¦
ÈÇаøÇнÇÇè - Áø°ø »ó¿¡¼ÀÇ ¹°ÁúÀÇ ÁõÂø / ÈÇаøÇнÇÇè - Áø°ø »ó¿¡¼ÀÇ ¹°ÁúÀÇ ÁõÂø ¥° ½ÇÇè¸ñÇ¥ Áø°ø »ó¿¡¼ÀÇ ¹°ÁúÀÇ ÁõÂøÀ» ÀÌÇØÇÏ°í, ¾Ð·Â¿¡ µû¶ó º¯ÈÇϴ è¹ö ¾ÈÀÇ Áõ¹ß ºÐÀÚ·®À» °è»êÇÑ´Ù. ¥± ½ÇÇè ÀÌ·Ð ¨ç ¾Ð·Â ´ÜÀ§ ȯ»ê 1atm ¡ë 101325Pa ¡ë 1.01325bar ¡ë 760mmHg(torr) ¡ë 14.696 psi ¨è ÁõÂø¼Óµµ(/s) deposition tickness monitor device ¿Ë½ºÆ®·Ò [angstrom] ¡¦
¡¥ silicon nitride Nitride Deposition Contact holes S D G Contact Etch Ion Implantation resist ox D G Scanning ionbeam S Metal Deposition and Etch drain S D G M
¡¥g, 2014³â 2¿ù ¸¸·á) - FDM(Fused Deposition Modeling Method, 2012³â ¸¸·á) ÀÚÀ¯·Î¿î ... / 3D ÇÁ¸°ÅÍ ¸¶ÄÉÆà Situational analysis Macro Environment °æÁ¦Àû, »çȸÀû Ãø¸é ±â¼úÀû Ãø
¡¥°üÇÑ Á¶»ç 2. È¼Ò Á¦ÀÛ ±â¼ú 3. Vacuum Deposition 4. AM ¼ÒÀÚ¿Í PM ¼ÒÀÚÀÇ ºñ±³ 5. Organic TFT EL Display OLEDÀÇ ÃÖ±Ù µ¿Çâ / EL DisplayÀÇ ±¸Á¶¿¡ µû¸¥ ºÐ·ù • ºÐ»êÇü : ¹ß±¤ÃþÀÌ Çü±¤Ã¼·Î¡¦