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PVD ¿Í CVD
PVD ¿Í CVD
PVD ¿Í CVD
Thin film Process and analysis
Thin film Process and analysis
Thin film Process and analysis
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±¸ ¼º
¿ø¸® ¹× Á¾·ù ±×¸®°í Ư¡
1
PVD
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2
CVD
2/16
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Thin Film Application
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Thin Film
ºÎÇÇ´ëºñ Ç¥¸éÀû ºñÀ²ÀÌ ³ôÀº ¸·À» ÀǹÌÇÏ¸ç §¬ ~ § ´ÜÀ§¸¦ Áö´Ñ´Ù.
¸·
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Physical Vapor Deposition
Áø°ø Áß¿¡¼ ±Ý¼ÓÀ» ±âȽÃÄÑ ±âÆÇ¿¡ ÁõÂø.
vaporation
E
1. ÁõÂø ÇÏ·Á´Â source materialÀ» µµ°¡´Ï¿¡ ³Ö°í °¡¿.
2. Source materialÀÌ ±âü»óÅ°¡ µÇ¾î ±âÆÇÀÇ Ç¥¸é¿¡ Ãæµ¹.
3. Ãæµ¹µÈ ±âü»óÅÂÀÇ ±Ý¼Ó¿øÀÚ°¡ ±âÆÇ¿¡ ÁõÂøµÊ.
Hermal Evaporation
T
-beam Evaporation
E
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Physical Vapor Deposition
³ôÀº ¿¡³ÊÁö¸¦ °®´Â ¹Ì¸³Àڵ鿡 ÀÇÇÑ Ãæµ¹¿¡ ÀÇÇØ¡¦(»ý·«)
|
¼ ±â»óÀ¸·Î ÁõÂø½ÃÅ°´Â ¹æ¹ý.
ÈÇÐÀû ¹ÝÀÀ »ý¼º¹°ÁúÀÇ Ç°ÁúÀÌÁÁ°í Àú¿Â,Àú¾Ð ¿¡¼ ÁøÇà.
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Chemical Vapor Deposition
ow Pressure CVD
L
»ó¾Ðº¸´Ù ³·Àº ¾Ð·Â¿¡¼ ±âÆÇ À§¿¡ ÇÊ¿ä ¹°ÁúÀ» ÁõÂøÇÏ´Â
°øÁ¤¿¡¼ »ç¿ë¹ÝÀÀ gasµéÀÇ ÈÇÐÀû ¹ÝÀÀ¹æ¹ý ÀÌ¿ë.
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Chemical Vapor Deposition
VD Á¾·ù¿Í Ư¡
C
Process
Advantages
Disadvantages
Applications
APCVD
(Low Temp)
- Simple reactor
- Fast deposition
- Low temperature
- Poor step coverage
- Particle contamination
- Low temp oxides, both
doped and undoped
LPCVD
- Excellent purity & uniformity
- Conformal step coverage
- Large wafer capacity
- High temperature
- Low deposition rate
- High temp oxide
- Silicon nitride
- Poly-Si
- W, WSi2
PECVD
- Low temperature
- Fast deposition
- Good step coverage
- Chemical and particle
contamination
- PMD(pre metal dielectric)
- Passivation nitride