반도체공정순서

1. polysilicon creation

2. crystal pulling

3. wafer slicing

4. lapping , etching and pollishing, cleaning

1) wafer lapping

2) wafer etching

3) wafer polishing

4) wafer cleaning

5. oxidation layering

6. photoresist coating

7. stepper exposure

8. develop and bake

9. acid and etch

10. spin rinse dry

11. probe test and die cut

12. wire bonding

13. packaging