Wafer cleaning
Types and sources of contamination
Particles- ¸ÕÁö, ²É°¡·ç, clothing particles, ¹ÚÅ׸®¾Æ µî. º¸ÅëÀÇ °ø°£(1Å¥ºò ÇÇÆ® ¾È¿¡)¿¡´Â0.5 micron ÀÌ»ó Å©±âÀÇ ÀÔÀÚ 10 6 °³ ÀÌ»ó ÀÖ´Ù. 20 micron ÀÌ»óÀÇ Áö¸§À» °®´Â ÀÔÀÚÀÇ °æ¿ì ½±°Ô °¡¶ó ¾ÉÀ¸¹Ç·Î ÁÖ·Î ¹®Á¦°¡ µÇ´Â ÀÔÀÚ´Â 0.1 to 20 micron ÀÇ Áö¸§À» °®´Â ÀÔÀÚÀÌ´Ù.
Inorganic contaminants ¿°, ¿ë¾×ÀÇ ÀÌ¿Â, ¹«°Å¿î metal ¿øÀÚ. recirculation systemsÀ̳ª Ưº°ÇÑ ¿ë¾×¿¡ ÀÇÇØ Á¦°ÅµÈ´Ù.
Organic contaminants - smog, skin oil, fluxes, lubricants, solvent vapors, monomers from plastic tubing and storage boxes that can condense on substrate. strong oxidizers, gaseous or liquidÀ» ÀÌ¿ëÇÏ¿© Á¦°ÅµÈ´Ù.
Impurities- incorporated during the formation of substrates or over layer films. º¸Åë Á¦°ÅµÇÁö ¾Ê´Â´Ù.
Wet cleaning
: Conversion of contaminant into a soluble compound or its washing off force by the force altering its adhesion to the surface
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Particles
Organic
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